PRECISION PROGRAMMABLE SPIN COATING SYSTEM (Model: SpinNXG-P2)

Laurell Spin Processor is used to distribute Photoresist in a uniform layer by spinning a Substrate.
Applications
• Micro-fabrication of Oxide Layers.
• Nano-scale & Micron-scale Uniform & Homogeneous Thin Film Preparation.
• Preparation of Photo-resist Layers for Photolithography & for defining Patterns in Micro-circuit Fabrication.
• Dielectric / Insulating Layers for Microcircuit Fabrication, Flat Screen Display, Anti-reflection, Magnetic Disk, CD, DVD & CD ROM Coatings.
• Magnetic Particle Suspensions, Head Lubricants, Conductive Oxide Coatings Television Tube Phosphor and many more.

Chemical Wet Bench Acid Clean:

• Chemical wet bench Acid clean is used for cleaning of unprocessed, new cut pieces to full 4 inch Si wafers.
• RCA/piranha of non-preprocessed (new) & wafers going into First nano furnaces, oxide and oxynitride etch of samples.
• Quartzware and PP petridishes for processing substrates.

Vacuum Coating unit model 12A4-D (Hind Hivac system)/ Electron Beam Evaporation:

A stream of high energy electrons heats up the source to generate vapors that condense onto a substrate to form a thin film. HHV provides electron guns from single pocket to multi pocket sources with large capacity for a range of applications from R&D to multi-layer depositions that require higher film thicknesses.

Applications:

To produces thin, homogenous, uniform, pure film coatings of various metals to achieve controlled effects in applications like optics, electronics, materials, thin film coating etc.

PlasmaPro 100 PECVD

Plasma Enhanced Chemical Vapour Deposition (PECVD) utilizes plasma to enhance the reaction of the precursors. It is a low temperature process when compared to conventional Chemical Vapour Deposition (CVD). It uses RF energy to generate plasma where the deposition can be done below 380C. The deposited material will be conformal in nature. The deposition rate is high compared to conventional CVD. The deposited material can have smooth surface. The deposited material will always be amorphous in nature. PlasmaPro 10 PECVD System is a deposition tool from Oxford Instruments.

Applications:
• High quality PECVD of Dielectric materials like SiOx, SiNx, SiOxNy, GeOx for photonics, dielectric layers, passivation and many other uses.
• Semiconductor materials like a-Si, Ge, SiGe can be deposited.
• Phosphorus and boron doped oxide films can be deposited.
• Stoichiometry of the deposited material can be controlled.
• Film stress can be controlled by high/low frequency mixing techniques.

Annealing Furnace

An annealing furnace is a laboratory equipment used to heat samples to a controlled temperature and then cool them at a defined rate. The process of annealing improves material properties such as crystallinity, conductivity, and mechanical stability by relieving internal stresses and promoting structural reorganization. The furnace allows precise control over temperature, heating duration, and atmosphere (air, inert gas, or vacuum), making it an essential tool for material processing experiments.

Profilometer: Dektak XT Stylus Profiler

The DektakXT Stylus Profiler is capable of quickly and accurately measuring feature heights on a surface. It can resolve step heights as small as 10nm. Variable force and measurement length settings make measurements possible on a wide range of materials and structures without damaging them. A magnified video targeting system permits positioning the needle tip near small surface features.

Applications
It is common to use a profilometer to measure film thickness and surface texture. Examples include thickness measurements made after spin coating or magnetron sputter deposition and height measurements that are used to calibrate the thickness monitor on a deposition system materials such as semiconductors, polymers, metals, and ceramics are commonly measured using this instrument.

Wedge Bonder – West Bond 747677E

The wire bonder is a wedge-to-wedge ultrasonic bonder designed to interconnect wire leads to semi-conductor, hybrid, or microwave devices. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations.

Probe Station and Parameter Analyser

A probe station is an interface tool to measure the electrical characteristics of microelectronic device. By using a combination of a microscope and micropositioners, users can accurately make contact with probes to touch onto their device and use other electronic meters to see their results.
The Probe Station facilitates electrical measurements at room temperature and in ambient conditions. Electrical contact is made via probe tips (5 µm tungsten standard) which are attached to micropositioners with 80 turns per inch resolution. The electrical signals are taken through the Keithley 4200A-SCS Parameter Analyzer which has 4 SMU units with a DC current range of 10aA-1A and voltage range of 0.2μV-210V. The parameter analyzer delivers synchronizing temperature-dependent current-voltage (I-V), capacitance-voltage (C-V), and ultra-fast pulsed I-V measurements.